Podcast EP179: An Expert Panel Discussion on the Move to Chiplets

Dan is joined by a panel of experts to discuss chiplets and 2.5/3D design. The panelists are: Saif Alam - Vice President of Engineering at Movellus Inc., Tony Mastroianni Siemens EDA- Advanced Packaging Solutions Director and Craig Bishop - CTO Deca Technologies. In this spirited and informative discussion the panel explores the move to chiplets. Why it's happening now and who can benefit from the trend are discussed in detail, along with considerations for ecosystem management. design methodology, the role of standards and addressing the risks associated with this new design style. The views, thoughts, and opinions expressed in these podcasts belong solely to the speaker, and not to the speaker’s employer, organization, committee or any other group or individual.